The grip rings manufactured by the Company have excellent dimensional precision of 0.01 mm. After passing through various tests for surface resistance (Ω), tensile strength and flexural strength, the products become more stable and more sophisticated. With such high-quality grip rings, the chip bonding machines can improve on the chip picking speed, reduce the processing time, eliminate product loss, and reduce the number of defective products to significantly reduce production costs.

The product is used as a grip ring for semiconductor chips and light-emitting diode (LED) chips. It is composed of an inner ring and an outer ring, which then grip the chips or the wafer firmly for excellent extension. Various specifications are available for the customer to choose from.

Dimension: 4 inches 5 inches 6 inches 8 inches 10 inches

Special specifications and dimensions of the grip rings can also be manufactured based on customer's requirements.