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The
grip rings manufactured by the Company have excellent dimensional precision of
 0.01 mm. After passing
through various tests for surface resistance (Ω), tensile strength and flexural
strength, the products become more stable and more sophisticated. With such
high-quality grip rings, the chip bonding machines can improve on the chip
picking speed, reduce the processing time, eliminate product loss, and reduce
the number of defective products to significantly reduce production costs. |
